IPApproach represents the semiconductor and packaging patents and portfolios below, each available for sale or license. Select a listing for the full technology summary, patent schedule, and supporting documentation.
Bifacial cell fabrication and, more particularly, but not exclusively, to a method of cell structure formation on a silicon substrate with fine controllable boron doping and suppressed edge shunting.
A system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board.
Tray holders that hold SIM or MMC cards and ejectable component assembly that allows insertion as well as ejection of SIM or MMC cards which can be used in electronic devices such as smartphone, tablet, etc.
