For SaleSemiconductor and Packaging
3-Dimensional Multi-Layered Modular Computer Architecture
US 8,274,792, US 9,164,555 and US 10,067,539, assigned to Beyond Blades Ltd, relate to semiconductor and packaging technology, and are available for sale through IPApproach.
- US Patents
- 3 granted
- Foreign Counterparts
- 2
- Assignee
- Beyond Blades Ltd
- Availability
- For Sale
Patents Included
- EP 1,934,668 B1
- CA 2,621,505 C
Technology Highlights
- The invention provides a computer architecture that significantly improves computer mass, volume & power densities.
- Provides high density computing platforms.
- The invention provides a solution for increase in device volumetric and mass efficiency, cooling problems, standardization problems and higher costs.
- The invention solves the limitation of bus speed for longer, larger latencies, cross-talk between signals, increases in noise pickup, worsen signal shape due to parasitic capacitance and parasitic inductance and electromagnetic noise that affect other devices nearby.
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Listing updated August 21, 2026
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