Liquid Cooled Metal Core Printed Circuit Board

US 9,686,887, assigned to Nicholas Michael D'Onofrio, covers a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board, and is available for sale through IPApproach.

US Patents

1 granted

Foreign Counterparts

1

Assignee

Nicholas Michael D'Onofrio

Availability

For Sale

Patents Included

• US 9,686,887↗

• CA 2,961,001 C

Technology Highlights

• The invention allows a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB.
• The system minimizes thermal bottlenecks between the electrical components and the cooling fluid while reducing the number of components required in previous liquid cooled electronics systems.
• The system increases thermal dissipation rates, higher possible input temperatures for cooling fluids, lower energy consumption, simplified production methods, and lower production costs.

Overview

The IP relates to a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board.

The technology disclosed provides the following advantages:

Listing updated August 21, 2026

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