Thermal Management of Three-dimensional Integrated Circuits

US 11,710,723, assigned to Kambix Innovations LLC, covers integrated circuits, thermal management of integrated circuits and three-dimensional (3D) integrated circuits, and is available for sale through IPApproach.

US Patents

1 granted

Assignee

Kambix Innovations LLC

Availability

For Sale

Patents Included

• US 11,710,723↗

Technology Highlights

• The invention provides for the design and optimization of a composition heat spreader to improve the thermal management of a 3D integrated circuit.
• The invention provides geometrical optimization of the inserts, embedded in a heat spreader, to improve its cooling performance for 3D integrated circuits.
• The invention allows the generated heat, throughout device layers, to be transferred via conduction to a heat sink through a heat spreader.
• The invention allows the size of the heat spreader and heat sink to be larger than other layers to extend the surface area exposed to the cooling fluid and to enhance the heat transfer to the ambient fluid.
• The invention provides a high-conductivity material that can be used to boost the thermal conductance of the heat spreader to overcome the decreasing cooling capability of the heat spreader.

Overview

The technology disclosed provides the following advantages:

Listing updated August 21, 2026

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